Pyro~
I just think your knowledge is spot on and how refreshing it is to converse with someone out side my JET team. I want to first thank you on my ability to explain little about cell phone processors. I still would like to go on the record that I am a PC processors engineer and doing the best I can to put the pieces together.
First, let me give you uber kudos, cuz you are correct, with regard to the die size of a Snapdragon processor .45 nanometers! (Those that care, same die size of a Nvidia 285 GPU)
The Snapdragon processor has built in DSP (Digital Signal Processor), 3g radio, built in Wifi, and for EVO exclusive 720p codec, 3d GPU, and GPS processor, and a host of other stuff.
I make processors that just do computing and when I look under a microscope with all that stuff listed above...I am truly amazed...I look at it (Not Snapdragon, something similar) and all fits on on your pinkie nail!!!
Back to your post...I am impressed with you knowledge and you are correct. THe total die size of a Snapdragon processor is about .45nm, including all the stuff listed above. The .13nm would be the Snapdragon core CPU micro architecture. I was only able to find Samsung Humminbird core process specs using .35nm process technology and that is rather large for today standards, witch is the equal, to Intel p III microprocessors chip (ca.1997)
I guess to finish you question. Further die size has nothing to do with the ability to transfer data. to certain extent. Die size is more in the ability to transfer...(Okies Jocks hit me) electrons. If you have one metal layer (Copper (Cu)) or what ever your processor is made out of. That electron has to travels to whatever transistor that is going to in order to give a (Yes/No) signal. Then let